The global semiconductor production equipment market size is expected to reach around US$ 121.87 billion by 2030 from US$ 63 billion in 2021 and is expected to grow at an impressive double-digit rate of 9.5% from 2021 to 2030.
The study includes drivers and restraints of this market. The study provides an analysis of the global semiconductor production equipment market for the period 2017-2030, wherein 2021 to 2030 is the forecast period and 2020 is considered as the base year.
Crucial factors accountable for market growth are:
- Rapid growth of consumer electronic product fosters the market growth.
- Rise in middle class lifestyle and surge in desire to use smart electronic devices.
- The growth in demand for mobile phones.
- The integration electronics devices with the Internet of Things (IoT).
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Semiconductor Manufacturing Equipment is a term that refers to the machinery that is used to make semiconductors. The semiconductor business is enormous, with many different uses. The semiconductor manufacturing equipment sector is classified into two categories: front-end and back-end. Semiconductor fabrication equipment is a critical component in the fabrication process. Fabricating semiconductors is a time-consuming process that necessitates the use of a high-quality manufacturing facility. Semiconductor manufacturing equipment includes oxidation systems, epitaxial reactors, diffusion systems, ion implantation equipment, physical vapour deposition systems, chemical vapour deposition systems, photolithography equipment, and etching equipment. In 2020, the Semiconductor Production Equipment Market was valued at US$ 62.5 billion and is expected to grow at a CAGR of 9.5% over the forecast period.
Regional Snapshots
Asia Pacific leads the semiconductor manufacturing equipment market accounting for more than 75% of revenue share in 2020 and is expected to grow at a CAGR of 8.5% during the forecast period owing to the supportive government initiatives and financial actions to boost semiconductor production in the region. For instance, On 29th September 2021Canon Inc. stated that it has reached an agreement to make Redlen Technologies Inc. a wholly owned subsidiary. The equity transfer was completed on September 28, 2021, making Redlen a completely owned subsidiary of Canon Inc. Canon will gain superior radiation detection and imaging technology from Redlen, which will be used in CZT semiconductor detector modules, which are crucial in the development of Photon Counting CT scanners (PCCT).
Market Dynamics
Driver
Consumer electronics is one of the most essential industries that is completely reliant on the semiconductor sector. Consumer electronics is a significant element of the electronics industry, and it contributes to the growth of the global semiconductor manufacturing equipment market. The number of foundries has increased globally due to rising demand for consumer electrical devices. Changing chip sizes and inventive layouts in various electronic devices have expanded semiconductor demand, resulting in large profits for semiconductor equipment producers. For instance, On 8th September 2021, Applied Materials, Inc. has announced new technologies and capabilities to aid customers in accelerating their heterogeneous chip design and integration technology roadmaps.
Restraint
Tiny dust particles disrupt the entire semiconductor production and fabrication process, necessitating the usage of a clean atmosphere and clean equipment. Furthermore, manufacturing faults generate supply delays, which can lead to additional losses such as order cancellations and client moves to other providers. The pattern complexity increases as the number of patterns on a chip grows due to its limited size. For correct data flow to the chip, this necessitates great precision. The demand for size reduction has increased the complexity of wafers, which has resulted in a high density of semiconductor chips, lowering the lithography wavelength. Photomasks and wafers will become more complicated as node sizes shrink, necessitating the purchase of new semiconductor manufacturing equipment. All of these issues stifle the semiconductor manufacturing equipment market's expansion.
Opportunity
The surge in demand for electronic products across the globe is expected to create huge opportunities for the growth of the Semiconductor Manufacturing Equipment Market.
Challenges
In semiconductor manufacturing, electrostatic charge poses problems, making it difficult to maintain high yield and product quality. A failure in static charge regulation can result in electrostatic discharge (ESD) damage, particle contamination, and equipment problems. These problems can be found in photomask fabrication, silicon wafer fabrication, back-end assembly, packaging, front-end device fabrication, and testing, among other semiconductor manufacturing processes. All these attributes are expected to be a major challenge in the growth of the Semiconductor Manufacturing Equipment Market.
Report Highlights
- The front-end semiconductor production equipment segment accounted for more than 60% revenue share in 2020.
- The 2.5D packaging architecture segment of the Semiconductor Production Equipment Market is estimated to lead the market with a market share of more than35% in 2020.
- By Geography, Asia Pacific is expected to lead the market contributing more than 75% revenue share in 2020 owing to favorable economic conditions and low labour costs in this region.
Recent Developments
- On 21st May 2021, Applied Materials Inc. issued a bullish prediction for the current quarter, citing orders from chipmakers scrambling to expand capacity to meet a surge in demand.
- On 27th January 2021, Vantex, the most advanced dielectric etch technology created exclusively for Sense.i, the most intelligent etch platform available, was announced by Lam Research Corp. For current and future generation NAND and DRAM memory devices, this ground-breaking architecture, based on etch leadership, promises improved performance and more extendibility.
- On 2nd April 2021, In response to increased demand, Taiwan Semiconductor Manufacturing Co., a major chip supplier to Apple Inc., stated that it will invest $100 billion over the next three years to increase production capacity.
Why should you invest in this report?
If you are aiming to enter the global semiconductor production equipment market, this report is a comprehensive guide that provides crystal clear insights into this niche market. All the major application areas for semiconductor production equipment are covered in this report and information is given on the important regions of the world where this market is likely to boom during the forecast period of 2021-2030, so that you can plan your strategies to enter this market accordingly.
Besides, through this report, you can have a complete grasp of the level of competition you will be facing in this hugely competitive market and if you are an established player in this market already, this report will help you gauge the strategies that your competitors have adopted to stay as market leaders in this market. For new entrants to this market, the voluminous data provided in this report is invaluable.
Some of the prominent players in the global semiconductor production equipment market include:
The global semiconductor production equipment market is characterized by the presence of various small and big players. The major market player includes Tokyo Electron Limited, Applied Materials, Inc., ASML, LAM RESEARCH CORPORATION, and Canon Inc.
Market Segmentation:
By Product
- Front-end equipment
- Lithography
- Polishing & grinding
- Water surface conditioning equipment
- Others
- Back-end equipment
- Wafer manufacturing equipment
- Assembly & packaging equipment
- Test equipment
- Others
By Dimension
- 2D
- 2.5D
- 3D
By Supply Chain Process
- OSAT
- IDM
- Foundry
Regional Analysis:
The geographical analysis of the global semiconductor production equipment market has been done for North America, Europe, Asia-Pacific, and the Rest of the World.
The North American Market is again segmented into the US, Canada, and Mexico. Coming to the European Market, it can be segmented further into the UK, Germany, France, Italy, Spain, and the rest. Coming to the Asia-Pacific, the global semiconductor production equipment Market is segmented into China, India, Japan, and Rest of Asia Pacific. Among others, the market is segmented into the Middle East and Africa, (GCC, North Africa, South Africa and Rest of the Middle East & Africa).
Key Questions Answered by the Report:
- What will be the size of the global semiconductor production equipment market in 2030?
- What is the expected CAGR for the semiconductor production equipment market between 2021 and 2030?
- Which are the top players active in this global market?
- What are the key drivers of this global market?
- How will the market situation change in the coming years?
- Which region held the highest market share in this global market?
- What are the common business tactics adopted by players?
- What is the growth outlook of the global semiconductor production equipment market?
TABLE OF CONTENT
Chapter 1. Introduction
1.1. Research Objective
1.2. Scope of the Study
1.3. Definition
Chapter 2. Research Methodology
2.1. Research Approach
2.2. Data Sources
2.3. Assumptions & Limitations
Chapter 3. Executive Summary
3.1. Market Snapshot
Chapter 4. Market Variables and Scope
4.1. Introduction
4.2. Market Classification and Scope
4.3. Industry Value Chain Analysis
4.3.1. Raw Material Procurement Analysis
4.3.2. Sales and Distribution Channel Analysis
4.3.3. Downstream Buyer Analysis
Chapter 5. COVID 19 Impact on Semiconductor Production Equipment Market
5.1. COVID-19 Landscape: Semiconductor Production Equipment Industry Impact
5.2. COVID 19 - Impact Assessment for the Industry
5.3. COVID 19 Impact: Global Major Government Policy
5.4. Market Trends and Opportunities in the COVID-19 Landscape
Chapter 6. Market Dynamics Analysis and Trends
6.1. Market Dynamics
6.1.1. Market Drivers
6.1.2. Market Restraints
6.1.3. Market Opportunities
6.2. Porter’s Five Forces Analysis
6.2.1. Bargaining power of suppliers
6.2.2. Bargaining power of buyers
6.2.3. Threat of substitute
6.2.4. Threat of new entrants
6.2.5. Degree of competition
Chapter 7. Competitive Landscape
7.1.1. Company Market Share/Positioning Analysis
7.1.2. Key Strategies Adopted by Players
7.1.3. Vendor Landscape
7.1.3.1. List of Suppliers
7.1.3.2. List of Buyers
Chapter 8. Global Semiconductor Production Equipment Market, By Product
8.1. Semiconductor Production Equipment Market, by Product Type, 2021-2030
8.1.1. Front-end equipment (Front-end equipment, Lithography, Polishing & grinding, Water surface conditioning equipment, Others)
8.1.1.1. Market Revenue and Forecast (2019-2030)
8.1.2. Back-end equipment (Wafer manufacturing equipment, Assembly & packaging equipment, Test equipment, Others)
8.1.2.1. Market Revenue and Forecast (2019-2030)
Chapter 9. Global Semiconductor Production Equipment Market, By Dimension
9.1. Semiconductor Production Equipment Market, by Dimension, 2021-2030
9.1.1. 2D
9.1.1.1. Market Revenue and Forecast (2019-2030)
9.1.2. 2.5D
9.1.2.1. Market Revenue and Forecast (2019-2030)
9.1.3. 3D
9.1.3.1. Market Revenue and Forecast (2019-2030)
Chapter 10. Global Semiconductor Production Equipment Market, By Supply Chain Process
10.1. Semiconductor Production Equipment Market, by Supply Chain Process, 2021-2030
10.1.1. OSAT
10.1.1.1. Market Revenue and Forecast (2019-2030)
10.1.2. IDM
10.1.2.1. Market Revenue and Forecast (2019-2030)
10.1.3. Foundry
10.1.3.1. Market Revenue and Forecast (2019-2030)
Chapter 11. Global Semiconductor Production Equipment Market, Regional Estimates and Trend Forecast
11.1. North America
11.1.1. Market Revenue and Forecast, by Product (2019-2030)
11.1.2. Market Revenue and Forecast, by Dimension (2019-2030)
11.1.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)
11.1.4. U.S.
11.1.4.1. Market Revenue and Forecast, by Product (2019-2030)
11.1.4.2. Market Revenue and Forecast, by Dimension (2019-2030)
11.1.4.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)
11.1.5. Rest of North America
11.1.5.1. Market Revenue and Forecast, by Product (2019-2030)
11.1.5.2. Market Revenue and Forecast, by Dimension (2019-2030)
11.1.5.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)
11.2. Europe
11.2.1. Market Revenue and Forecast, by Product (2019-2030)
11.2.2. Market Revenue and Forecast, by Dimension (2019-2030)
11.2.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)
11.2.4. UK
11.2.4.1. Market Revenue and Forecast, by Product (2019-2030)
11.2.4.2. Market Revenue and Forecast, by Dimension (2019-2030)
11.2.4.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)
11.2.5. Germany
11.2.5.1. Market Revenue and Forecast, by Product (2019-2030)
11.2.5.2. Market Revenue and Forecast, by Dimension (2019-2030)
11.2.5.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)
11.2.6. France
11.2.6.1. Market Revenue and Forecast, by Product (2019-2030)
11.2.6.2. Market Revenue and Forecast, by Dimension (2019-2030)
11.2.6.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)
11.2.7. Rest of Europe
11.2.7.1. Market Revenue and Forecast, by Product (2019-2030)
11.2.7.2. Market Revenue and Forecast, by Dimension (2019-2030)
11.2.7.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)
11.3. APAC
11.3.1. Market Revenue and Forecast, by Product (2019-2030)
11.3.2. Market Revenue and Forecast, by Dimension (2019-2030)
11.3.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)
11.3.4. India
11.3.4.1. Market Revenue and Forecast, by Product (2019-2030)
11.3.4.2. Market Revenue and Forecast, by Dimension (2019-2030)
11.3.4.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)
11.3.5. China
11.3.5.1. Market Revenue and Forecast, by Product (2019-2030)
11.3.5.2. Market Revenue and Forecast, by Dimension (2019-2030)
11.3.5.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)
11.3.6. Japan
11.3.6.1. Market Revenue and Forecast, by Product (2019-2030)
11.3.6.2. Market Revenue and Forecast, by Dimension (2019-2030)
11.3.6.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)
11.3.7. Rest of APAC
11.3.7.1. Market Revenue and Forecast, by Product (2019-2030)
11.3.7.2. Market Revenue and Forecast, by Dimension (2019-2030)
11.3.7.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)
11.4. MEA
11.4.1. Market Revenue and Forecast, by Product (2019-2030)
11.4.2. Market Revenue and Forecast, by Dimension (2019-2030)
11.4.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)
11.4.4. GCC
11.4.4.1. Market Revenue and Forecast, by Product (2019-2030)
11.4.4.2. Market Revenue and Forecast, by Dimension (2019-2030)
11.4.4.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)
11.4.5. North Africa
11.4.5.1. Market Revenue and Forecast, by Product (2019-2030)
11.4.5.2. Market Revenue and Forecast, by Dimension (2019-2030)
11.4.5.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)
11.4.6. South Africa
11.4.6.1. Market Revenue and Forecast, by Product (2019-2030)
11.4.6.2. Market Revenue and Forecast, by Dimension (2019-2030)
11.4.6.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)
11.4.7. Rest of MEA
11.4.7.1. Market Revenue and Forecast, by Product (2019-2030)
11.4.7.2. Market Revenue and Forecast, by Dimension (2019-2030)
11.4.7.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)
11.5. Latin America
11.5.1. Market Revenue and Forecast, by Product (2019-2030)
11.5.2. Market Revenue and Forecast, by Dimension (2019-2030)
11.5.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)
11.5.4. Brazil
11.5.4.1. Market Revenue and Forecast, by Product (2019-2030)
11.5.4.2. Market Revenue and Forecast, by Dimension (2019-2030)
11.5.4.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)
11.5.5. Rest of LATAM
11.5.5.1. Market Revenue and Forecast, by Product (2019-2030)
11.5.5.2. Market Revenue and Forecast, by Dimension (2019-2030)
11.5.5.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)
Chapter 12. Company Profiles
12.1. Tokyo Electron Limited
12.1.1. Company Overview
12.1.2. Product Offerings
12.1.3. Financial Performance
12.1.4. Recent Initiatives
12.2. Applied Materials, Inc.
12.2.1. Company Overview
12.2.2. Product Offerings
12.2.3. Financial Performance
12.2.4. Recent Initiatives
12.3. ASML
12.3.1. Company Overview
12.3.2. Product Offerings
12.3.3. Financial Performance
12.3.4. Recent Initiatives
12.4. LAM RESEARCH CORPORATION
12.4.1. Company Overview
12.4.2. Product Offerings
12.4.3. Financial Performance
12.4.4. Recent Initiatives
12.5. Canon Inc
12.5.1. Company Overview
12.5.2. Product Offerings
12.5.3. Financial Performance
12.5.4. Recent Initiatives
Chapter 13. Research Methodology
13.1. Primary Research
13.2. Secondary Research
13.3. Assumptions
Chapter 14. Appendix
14.1. About Us
14.2. Glossary of Terms
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