The global advanced packaging market size is expected to reach around US$ 41.8 billion by 2030 from US$ 24.2 billion in 2020 and is expected to grow at an impressive double-digit rate of 8.1% from 2021 to 2030.
The study includes drivers and restraints of this market. The study provides an analysis of the global advanced packaging market for the period 2017-2030, wherein 2021 to 2030 is the forecast period and 2020 is considered as the base year.
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Crucial factors accountable for market growth are:
- The cost effectiveness of the Advanced packaging technology drives the market growth.
- Rise in demand for automobiles in the market.
- Increased demand for consumer electronics products fosters the market growth.
- Surge in demand for miniaturization of devices.
Report Highlights
- The Fan-out wafer-level packaging (FOWLP) product type segment is accounted largest revenue share in 2020.
- The consumer electronics end use segment of the market is estimated to lead the market with largest revenue share in 2020.
- By Geography, Asia Pacific is expected to lead the market contributing more than 64% revenue share in 2020 and is expected to grow at a CAGR of 8.2% during the forecast period owing the growth of semiconductor industry in this region and also by the presence of major market players.
Report Scope of the Advanced Packaging Market
Report Coverage | Details |
Market Size in 2020 | US$ 24.2 billion |
Growth Rate from 2021 to 2030 | CAGR of 8.1% |
Fastest Growing Market | North America |
Base Year | 2021 |
Why should you invest in this report?
If you are aiming to enter the global advanced packaging market, this report is a comprehensive guide that provides crystal clear insights into this niche market. All the major application areas for advanced packaging are covered in this report and information is given on the important regions of the world where this market is likely to boom during the forecast period of 2021-2030, so that you can plan your strategies to enter this market accordingly.
Besides, through this report, you can have a complete grasp of the level of competition you will be facing in this hugely competitive market and if you are an established player in this market already, this report will help you gauge the strategies that your competitors have adopted to stay as market leaders in this market. For new entrants to this market, the voluminous data provided in this report is invaluable.
Regional Snapshots
Asia Pacific leads the advanced packaging market contributing a market share of more than 64% in 2020 and is expected to grow at a CAGR of 8.2% during the forecast period owing to the presence of major market players continuously involved in R&D and in the development of advanced packaging technologies. For instance, on 6th May 2021, Samsung Electronics, a world leader in advanced semiconductor technology, announced the availability of its next-generation 2.5D packaging technology called Interposer-Cube4 (I-Cube4). It is leading the evolution of chip packaging technology. Samsung’s I-Cube, a heterogeneous combination of technologythat uses multiple dies to operate as a single chip in one package by horizontally placing one or more logic dies (CPU, GPU, etc.) and several High Bandwidth Memory (HBM) dies on top of the silicon interposer.
The major market player Amkor Technology Inc., ASE Technology Holding Co. Ltd., China Wafer Level CSP Co., Ltd., ChipMOS Technologies, Inc., FlipChip International LLC, HANA Micron Inc., Jiangsu Changjiang Electronics Technology Co., Ltd., King Yuan Electronics Corp. (KYEC), Nepes Corporation, Powertech Technology, Inc., Samsung Semiconductor, Inc., SIGNETICS, TianshuiHuatian Technology Co.Ltd., TongFu Microelectronics Co., Ltd., TSMC Ltd., UTAC Holdings Ltd. and Veeco Instruments Inc.
Segments Covered in the Report
By Type
- Flip Chip CSP
- Flip-Chip Ball Grid Array
- Wafer Level CSP
- 5D/3D
- Fan Out WLP
- Others
By End-use
- Consumer Electronics
- Automotive
- Industrial
- Healthcare
- Aerospace & Defense
- Others
Regional Analysis:
The geographical analysis of the global advanced packaging market has been done for North America, Europe, Asia-Pacific, and the Rest of the World.
The North American Market is again segmented into the US, Canada, and Mexico. Coming to the European Market, it can be segmented further into the UK, Germany, France, Italy, Spain, and the rest. Coming to the Asia-Pacific, the global advanced packaging Market is segmented into China, India, Japan, and Rest of Asia Pacific. Among others, the market is segmented into the Middle East and Africa, (GCC, North Africa, South Africa and Rest of the Middle East & Africa).
Key Questions Answered by the Report:
- What will be the size of the global advanced packaging market in 2030?
- What is the expected CAGR for the advanced packaging market between 2021 and 2030?
- Which are the top players active in this global market?
- What are the key drivers of this global market?
- How will the market situation change in the coming years?
- Which region held the highest market share in this global market?
- What are the common business tactics adopted by players?
- What is the growth outlook of the global advanced packaging market?
TABLE OF CONTENT
Chapter 1. Introduction
1.1. Research Objective
1.2. Scope of the Study
1.3. Definition
Chapter 2. Research Methodology
2.1. Research Approach
2.2. Data Sources
2.3. Assumptions & Limitations
Chapter 3. Executive Summary
3.1. Market Snapshot
Chapter 4. Market Variables and Scope
4.1. Introduction
4.2. Market Classification and Scope
4.3. Industry Value Chain Analysis
4.3.1. Raw Material Procurement Analysis
4.3.2. Sales and Distribution Channel Analysis
4.3.3. Downstream Buyer Analysis
Chapter 5. COVID 19 Impact on Advanced Packaging Market
5.1. COVID-19 Landscape: Advanced Packaging Industry Impact
5.2. COVID 19 - Impact Assessment for the Industry
5.3. COVID 19 Impact: Global Major Government Policy
5.4. Market Trends and Opportunities in the COVID-19 Landscape
Chapter 6. Market Dynamics Analysis and Trends
6.1. Market Dynamics
6.1.1. Market Drivers
6.1.2. Market Restraints
6.1.3. Market Opportunities
6.2. Porter’s Five Forces Analysis
6.2.1. Bargaining power of suppliers
6.2.2. Bargaining power of buyers
6.2.3. Threat of substitute
6.2.4. Threat of new entrants
6.2.5. Degree of competition
Chapter 7. Competitive Landscape
7.1.1. Company Market Share/Positioning Analysis
7.1.2. Key Strategies Adopted by Players
7.1.3. Vendor Landscape
7.1.3.1. List of Suppliers
7.1.3.2. List of Buyers
Chapter 8. Global Advanced Packaging Market, By Product
8.1. Advanced Packaging Market, by Product Type, 2021-2030
8.1.1. Flip Chip CSP
8.1.1.1. Market Revenue and Forecast (2019-2030)
8.1.2. Flip-Chip Ball Grid Array
8.1.2.1. Market Revenue and Forecast (2019-2030)
8.1.3. Wafer Level CSP
8.1.3.1. Market Revenue and Forecast (2019-2030)
8.1.4. 5D/3D
8.1.4.1. Market Revenue and Forecast (2019-2030)
8.1.5. Fan Out WLP
8.1.5.1. Market Revenue and Forecast (2019-2030)
8.1.6. Others
8.1.6.1. Market Revenue and Forecast (2019-2030)
Chapter 9. Global Advanced Packaging Market, By End User
9.1. Advanced Packaging Market, by End User, 2021-2030
9.1.1. Consumer Electronics
9.1.1.1. Market Revenue and Forecast (2019-2030)
9.1.2. Automotive
9.1.2.1. Market Revenue and Forecast (2019-2030)
9.1.3. Industrial
9.1.3.1. Market Revenue and Forecast (2019-2030)
9.1.4. Healthcare
9.1.4.1. Market Revenue and Forecast (2019-2030)
9.1.5. Aerospace & Defense
9.1.5.1. Market Revenue and Forecast (2019-2030)
9.1.6. Others
9.1.6.1. Market Revenue and Forecast (2019-2030)
Chapter 10. Global Advanced Packaging Market, Regional Estimates and Trend Forecast
10.1. North America
10.1.1. Market Revenue and Forecast, by Product (2019-2030)
10.1.2. Market Revenue and Forecast, by End User (2019-2030)
10.1.3. U.S.
10.1.3.1. Market Revenue and Forecast, by Product (2019-2030)
10.1.3.2. Market Revenue and Forecast, by End User (2019-2030)
10.1.4. Rest of North America
10.1.4.1. Market Revenue and Forecast, by Product (2019-2030)
10.1.4.2. Market Revenue and Forecast, by End User (2019-2030)
10.2. Europe
10.2.1. Market Revenue and Forecast, by Product (2019-2030)
10.2.2. Market Revenue and Forecast, by End User (2019-2030)
10.2.3. UK
10.2.3.1. Market Revenue and Forecast, by Product (2019-2030)
10.2.3.2. Market Revenue and Forecast, by End User (2019-2030)
10.2.4. Germany
10.2.4.1. Market Revenue and Forecast, by Product (2019-2030)
10.2.4.2. Market Revenue and Forecast, by End User (2019-2030)
10.2.5. France
10.2.5.1. Market Revenue and Forecast, by Product (2019-2030)
10.2.5.2. Market Revenue and Forecast, by End User (2019-2030)
10.2.6. Rest of Europe
10.2.6.1. Market Revenue and Forecast, by Product (2019-2030)
10.2.6.2. Market Revenue and Forecast, by End User (2019-2030)
10.3. APAC
10.3.1. Market Revenue and Forecast, by Product (2019-2030)
10.3.2. Market Revenue and Forecast, by End User (2019-2030)
10.3.3. India
10.3.3.1. Market Revenue and Forecast, by Product (2019-2030)
10.3.3.2. Market Revenue and Forecast, by End User (2019-2030)
10.3.4. China
10.3.4.1. Market Revenue and Forecast, by Product (2019-2030)
10.3.4.2. Market Revenue and Forecast, by End User (2019-2030)
10.3.5. Japan
10.3.5.1. Market Revenue and Forecast, by Product (2019-2030)
10.3.5.2. Market Revenue and Forecast, by End User (2019-2030)
10.3.6. Rest of APAC
10.3.6.1. Market Revenue and Forecast, by Product (2019-2030)
10.3.6.2. Market Revenue and Forecast, by End User (2019-2030)
10.4. MEA
10.4.1. Market Revenue and Forecast, by Product (2019-2030)
10.4.2. Market Revenue and Forecast, by End User (2019-2030)
10.4.3. GCC
10.4.3.1. Market Revenue and Forecast, by Product (2019-2030)
10.4.3.2. Market Revenue and Forecast, by End User (2019-2030)
10.4.4. North Africa
10.4.4.1. Market Revenue and Forecast, by Product (2019-2030)
10.4.4.2. Market Revenue and Forecast, by End User (2019-2030)
10.4.5. South Africa
10.4.5.1. Market Revenue and Forecast, by Product (2019-2030)
10.4.5.2. Market Revenue and Forecast, by End User (2019-2030)
10.4.6. Rest of MEA
10.4.6.1. Market Revenue and Forecast, by Product (2019-2030)
10.4.6.2. Market Revenue and Forecast, by End User (2019-2030)
10.5. Latin America
10.5.1. Market Revenue and Forecast, by Product (2019-2030)
10.5.2. Market Revenue and Forecast, by End User (2019-2030)
10.5.3. Brazil
10.5.3.1. Market Revenue and Forecast, by Product (2019-2030)
10.5.3.2. Market Revenue and Forecast, by End User (2019-2030)
10.5.4. Rest of LATAM
10.5.4.1. Market Revenue and Forecast, by Product (2019-2030)
10.5.4.2. Market Revenue and Forecast, by End User (2019-2030)
Chapter 11. Company Profiles
11.1. Amkor Technology Inc.
11.1.1. Company Overview
11.1.2. Product Offerings
11.1.3. Financial Performance
11.1.4. Recent Initiatives
11.2. ASE Technology Holding Co. Ltd.
11.2.1. Company Overview
11.2.2. Product Offerings
11.2.3. Financial Performance
11.2.4. Recent Initiatives
11.3. China Wafer Level CSP Co., Ltd.
11.3.1. Company Overview
11.3.2. Product Offerings
11.3.3. Financial Performance
11.3.4. Recent Initiatives
11.4. ChipMOS Technologies, Inc.
11.4.1. Company Overview
11.4.2. Product Offerings
11.4.3. Financial Performance
11.4.4. Recent Initiatives
11.5. FlipChip International LLC
11.5.1. Company Overview
11.5.2. Product Offerings
11.5.3. Financial Performance
11.5.4. Recent Initiatives
11.6. HANA Micron Inc.
11.6.1. Company Overview
11.6.2. Product Offerings
11.6.3. Financial Performance
11.6.4. Recent Initiatives
11.7. Jiangsu Changjiang Electronics Technology Co., Ltd.
11.7.1. Company Overview
11.7.2. Product Offerings
11.7.3. Financial Performance
11.7.4. Recent Initiatives
11.8. King Yuan Electronics Corp. (KYEC)
11.8.1. Company Overview
11.8.2. Product Offerings
11.8.3. Financial Performance
11.8.4. Recent Initiatives
11.9. Nepes Corporation
11.9.1. Company Overview
11.9.2. Product Offerings
11.9.3. Financial Performance
11.9.4. Recent Initiatives
11.10. Powertech Technology, Inc.
11.10.1. Company Overview
11.10.2. Product Offerings
11.10.3. Financial Performance
11.10.4. Recent Initiatives
Chapter 12. Research Methodology
12.1. Primary Research
12.2. Secondary Research
12.3. Assumptions
Chapter 13. Appendix
13.1. About Us
13.2. Glossary of Terms
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