The global Compound Semiconductor Marketis expected to grow at the highest CAGR of 6.2% from 2020 – 2027 and the market is projected to generate US$ 44.52 billion by 2027.
Precedence Research, Recently Published Report on “Compound Semiconductor Market Size, Share, Growth, Trends, Segment Forecasts, Regional Outlook 2020 - 2027”. The report offers an up-to-date analysis regarding the current market scenario, latest trends, key drivers, potential challenges, profitability graph and the overall market environment.
Compound semiconductors are referred as semiconductors that are made from two or more elements from different groups in the periodic table, and are synthesized using various deposition technologies. Devices made from semiconductors are an essential component of various electronic circuits, as they possess unique features such as high current & voltage holding capacity, high operational temperatures, wide band gap, and ability to generate microwave signals.
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Compound semiconductors offer significant performance advantages over silicon semiconductors that are highly essential for a growing range of technology applications. Compound semiconductors such as InP and GaAs can operate at speeds that have higher magnitudes compared to silicon. Additionally, compound semiconductors can receive and generate broad range of electromagnetic spectrum ranging from high frequency ultraviolet visible light to long wavelength infrared light. Other properties offered by the compound semiconductor material include communications (lasers and receivers for fiber-optics) and ability to sense and emit light in the form of general lighting (LEDs).
Growth Factors
Increasing demand for high speed and efficiency products has prominently driven the market growth for compound semiconductors in the recent past. Integration of high-end technologies such as artificial intelligence, machine learning, and Internet of Things (IoT) in the communication sector to enhance its performance is the other prime factor that boosts the market growth. Further, increasing usage of compound semiconductor in various electronic applications that include electronic wafer, film coatings, and integrated circuits expected to drive the market prominently over the next few years. Automotive industry has witness dramatic changes in the recent past due to rising advancement in the electronic products. Automotive innovations such as electric vehicle and autonomous cars have fulfilled the maximum required integration of semiconductor electronics in the automotive sector. The aforementioned factor fuels the market growth prominently.
However, high fabrication and material cost may hamper the market growth in the near future. The prices of compound semiconductor products are much higher as compared to silicon semiconductors due to complex manufacturing processes and usage of high-priced state-of-the-art equipment during fabrication.
Report Highlights
- In 2019, the Asia Pacific captured maximum revenue share of nearly 50% in the global compound semiconductor market in 2019. In addition, the region analyzed to witness the highest growth over the forecast period. This is mainly due to the escalating demand of consumer electronic products along with significant penetration of wireless communication technologies in the region.
- North America and Europe are the other significant revenue contributors in the global compound semiconductor market. Their growth is mainly attributed to the escalating development of automotive and telecommunication sectors. Advent of electrification of vehicles, artificial Intelligence, and digitalization has significantly propelled the market growth in above mentioned regions.
- By application, IT & Telecom accounted for the major market value share of nearly 45% in 2019 and expected to witness substantial growth over the analysis period. This is attributed to rising demand for semiconductor elements in wireless and mobile communications. However, consumer electronics projected to register the most lucrative growth rate during the forecast period.
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Regional Snapshots
In 2019, the Asia Pacific accounted for the major market value share of around 45% in the global compound semiconductor market and projected to register the fastest growth over the analysis period. Escalating growth of consumer electronics and automotive industry in the region are the prime factor that propels the market growth. In addition, the region is highly lucrative for the implementation of advanced and up-coming technologies such as artificial intelligence, machine learning, big data, and analytics.
Key Players & Strategies
The global compound semiconductor market is highly competitive and fragmented with the presence of numerous market players. These players are largely focused towards product development and enhancement to cater the rapidly changing consumer need. For instance, in May 2020, OSRAM launched a new 24V TEC Flex family that provides uniform illumination over a broad range of outdoor and indoor applications. TEC Flex Tunable White (TW) can be implemented for continuous modulation of color temperature ranging from 2700K to 6500K during maintenance of high color yield. Some of the market participants are also looking towards inorganic growth strategies such as merger & acquisition, partnership, and collaboration with other players in the value chain. For instance, in February 2020, Qorvo acquired Decawave, a Ireland-based company that is a pioneer in ultra-wideband (UWB) technology and offer UWB solutions for automobile, mobile, and IoT applications.
Some of the key players operating in the market are Nichia Corporation, Cree Inc., Qorvo, Samsung Electronics, Taiwan Semiconductor Manufacturing Company Ltd., STMicroelectronics NV, NXP Semiconductor N.V., Texas Instruments Inc., Renesas Electronics Corporation, and Infineon Technologies AG among others.
Segments Covered in the Report
This research study encompasses comprehensive assessment of the marketplace revenue with the help of prevalent quantitative and qualitative intelligences, and prognoses of the market. This report presents breakdown of market into major and niche segments. Furthermore, this research study gauges market revenue growth and its drift at global, regional, and country from 2016 to 2027. This report comprises market division and its revenue valuation by categorizing it depending on deposition technology, type, product, application, and region:
By Deposition Technology
- Molecular Beam Epitaxy
- Metal Organic Molecular Beam Epitaxy
- Chemical Vapor Deposition
- Metal Organic Chemical Vapor Deposition (MOCVD)
- Ammonothermal
- Hydride Vapor Phase Epitaxy
- Atomic Layer Deposition
- Liquid Phase Epitaxy
- Others
By Type
- II-VI Compound Semiconductors
- Cadmium Telluride
- Cadmium Selenide
- Zinc Selenide
- III-V Compound Semiconductors
- Gallium Phosphide
- Gallium Nitride
- Indium Phosphide
- Gallium Arsenide
- Indium Antimonide
- IV-IV Compound Semiconductors
- Silicon Germanium
- Silicon Carbide
- Sapphire
- Others
- Aluminum Indium Arsenide
- Aluminum Gallium Arsenide
- Aluminum Gallium Phosphide
- Aluminum Gallium Nitride
- Cadmium Zinc Telluride
- Indium Gallium Nitride
By Product
- Transistors
- Metal Oxide Semiconductor Field-Effect Transistors
- High Electron Mobility Transistors
- Metal Semiconductor Field-Effect Transistors
- Power Semiconductor
- Diodes & Rectifiers
- Zener Diode
- PIN Diode
- Light-Emitting Diode
- Schottky Diode
- Integrated Circuits
- Radio Frequency Integrated Circuits
- Monolithic Microwave Integrated Circuits
- Others
By Application
- Industrial and Energy & Power
- Wind Turbines & Wind Power System
- Smart Grid
- Motor Drives
- Photovoltaic Inverters
- Consumer Electronics
- LED Lighting
- Invertors
- Switch Mode Consumer Power Supply System
- IT & Telecom
- Satellite Communication
- Signal Amplifiers and Switching System
- RF
- Radar
- Automotive
- Chemical Vapor Deposition Braking System
- Electric Vehicle & Hybrid Electric Vehicles
- Automobile Motor Drives
- Rail Traction
- Aerospace & Defense
- Ships & Vessels
- Combat Vehicles
- Microwave Radiation
- Healthcare
- Biomedical Electronics
- Implantable Medical Device
By Regional Outlook
- North America
- U.S.
- Canada
- Europe
- U.K.
- Germany
- France
- Asia Pacific
- China
- India
- Japan
- South Korea
- Rest of the World
Chapter 1. Introduction
1.1. Research Objective
1.2. Scope of the Study
1.3. Definition
Chapter 2. Research Methodology
2.1. Research Approach
2.2. Data Sources
2.3. Assumptions & Limitations
Chapter 3. Executive Summary
3.1. Market Snapshot
Chapter 4. Market Variables and Scope
4.1. Introduction
4.2. Market Classification and Scope
4.3. Industry Value Chain Analysis
4.3.1. Raw Material Procurement Analysis
4.3.2. Sales and Distribution Channel Analysis
4.3.3. Downstream Buyer Analysis
Chapter 5. Market Dynamics Analysis and Trends
5.1. Market Dynamics
5.1.1. Market Drivers
5.1.2. Market Restraints
5.1.3. Market Opportunities
5.2. Porter’s Five Forces Analysis
5.2.1. Bargaining power of suppliers
5.2.2. Bargaining power of buyers
5.2.3. Threat of substitute
5.2.4. Threat of new entrants
5.2.5. Degree of competition
Chapter 6. Competitive Landscape
6.1.1. Company Market Share/Positioning Analysis
6.1.2. Key Strategies Adopted by Players
6.1.3. Vendor Landscape
6.1.3.1. List of Suppliers
6.1.3.2. List of Buyers
Chapter 7. Global Compound Semiconductor Market, By Product
7.1. Compound Semiconductor Market, by Product Type, 2020-2027
7.1.1. Transistors
7.1.1.1. Market Revenue and Forecast (2016-2027)
7.1.2. Power Semiconductor
7.1.2.1. Market Revenue and Forecast (2016-2027)
7.1.3. Diodes & Rectifiers
7.1.3.1. Market Revenue and Forecast (2016-2027)
7.1.4. Integrated Circuits
7.1.4.1. Market Revenue and Forecast (2016-2027)
7.1.5. Others
7.1.5.1. Market Revenue and Forecast (2016-2027)
Chapter 8. Global Compound Semiconductor Market, By Type
8.1. Compound Semiconductor Market, by Type, 2020-2027
8.1.1. II-VI Compound Semiconductors
8.1.1.1. Market Revenue and Forecast (2016-2027)
8.1.2. III-V Compound Semiconductors
8.1.2.1. Market Revenue and Forecast (2016-2027)
8.1.3. IV-IV Compound Semiconductors
8.1.3.1. Market Revenue and Forecast (2016-2027)
8.1.4. Sapphire
8.1.4.1. Market Revenue and Forecast (2016-2027)
8.1.5. Others
8.1.5.1. Market Revenue and Forecast (2016-2027)
Chapter 9. Global Compound Semiconductor Market, By Deposition Technology
9.1. Compound Semiconductor Market, by Deposition Technology, 2020-2027
9.1.1. Molecular Beam Epitaxy
9.1.1.1. Market Revenue and Forecast (2016-2027)
9.1.2. Chemical Vapor Deposition
9.1.2.1. Market Revenue and Forecast (2016-2027)
9.1.3. Ammonothermal
9.1.3.1. Market Revenue and Forecast (2016-2027)
9.1.4. Hydride Vapor Phase Epitaxy
9.1.4.1. Market Revenue and Forecast (2016-2027)
9.1.5. Atomic Layer Deposition
9.1.5.1. Market Revenue and Forecast (2016-2027)
9.1.6. Liquid Phase Epitaxy
9.1.6.1. Market Revenue and Forecast (2016-2027)
9.1.7. Others
9.1.7.1. Market Revenue and Forecast (2016-2027)
Chapter 10. Global Compound Semiconductor Market, By Application
10.1. Compound Semiconductor Market, by Application, 2020-2027
10.1.1. Industrial and Energy & Power
10.1.1.1. Market Revenue and Forecast (2016-2027)
10.1.2. Consumer Electronics
10.1.2.1. Market Revenue and Forecast (2016-2027)
10.1.3. IT & Telecom
10.1.3.1. Market Revenue and Forecast (2016-2027)
10.1.4. Automotive
10.1.4.1. Market Revenue and Forecast (2016-2027)
10.1.5. Aerospace & Defense
10.1.5.1. Market Revenue and Forecast (2016-2027)
10.1.6. Healthcare
10.1.6.1. Market Revenue and Forecast (2016-2027)
Chapter 11. Global Compound Semiconductor Market, Regional Estimates and Trend Forecast
11.1. North America
11.1.1. Market Revenue and Forecast, by Product (2016-2027)
11.1.2. Market Revenue and Forecast, by Type (2016-2027)
11.1.3. Market Revenue and Forecast, by Deposition Technology (2016-2027)
11.1.4. Market Revenue and Forecast, by Application (2016-2027)
11.1.5. U.S.
11.1.5.1. Market Revenue and Forecast, by Product (2016-2027)
11.1.5.2. Market Revenue and Forecast, by Type (2016-2027)
11.1.5.3. Market Revenue and Forecast, by Deposition Technology (2016-2027)
11.1.5.4. Market Revenue and Forecast, by Application (2016-2027)
11.1.6. Rest of North America
11.1.6.1. Market Revenue and Forecast, by Product (2016-2027)
11.1.6.2. Market Revenue and Forecast, by Type (2016-2027)
11.1.6.3. Market Revenue and Forecast, by Deposition Technology (2016-2027)
11.1.6.4. Market Revenue and Forecast, by Application (2016-2027)
11.2. Europe
11.2.1. Market Revenue and Forecast, by Product (2016-2027)
11.2.2. Market Revenue and Forecast, by Type (2016-2027)
11.2.3. Market Revenue and Forecast, by Deposition Technology (2016-2027)
11.2.4. Market Revenue and Forecast, by Application (2016-2027)
11.2.5. UK
11.2.5.1. Market Revenue and Forecast, by Product (2016-2027)
11.2.5.2. Market Revenue and Forecast, by Type (2016-2027)
11.2.5.3. Market Revenue and Forecast, by Deposition Technology (2016-2027)
11.2.5.4. Market Revenue and Forecast, by Application (2016-2027)
11.2.6. Germany
11.2.6.1. Market Revenue and Forecast, by Product (2016-2027)
11.2.6.2. Market Revenue and Forecast, by Type (2016-2027)
11.2.6.3. Market Revenue and Forecast, by Deposition Technology (2016-2027)
11.2.6.4. Market Revenue and Forecast, by Application (2016-2027)
11.2.7. France
11.2.7.1. Market Revenue and Forecast, by Product (2016-2027)
11.2.7.2. Market Revenue and Forecast, by Type (2016-2027)
11.2.7.3. Market Revenue and Forecast, by Deposition Technology (2016-2027)
11.2.7.4. Market Revenue and Forecast, by Application (2016-2027)
11.2.8. Rest of Europe
11.2.8.1. Market Revenue and Forecast, by Product (2016-2027)
11.2.8.2. Market Revenue and Forecast, by Type (2016-2027)
11.2.8.3. Market Revenue and Forecast, by Deposition Technology (2016-2027)
11.2.8.4. Market Revenue and Forecast, by Application (2016-2027)
11.3. APAC
11.3.1. Market Revenue and Forecast, by Product (2016-2027)
11.3.2. Market Revenue and Forecast, by Type (2016-2027)
11.3.3. Market Revenue and Forecast, by Deposition Technology (2016-2027)
11.3.4. Market Revenue and Forecast, by Application (2016-2027)
11.3.5. India
11.3.5.1. Market Revenue and Forecast, by Product (2016-2027)
11.3.5.2. Market Revenue and Forecast, by Type (2016-2027)
11.3.5.3. Market Revenue and Forecast, by Deposition Technology (2016-2027)
11.3.5.4. Market Revenue and Forecast, by Application (2016-2027)
11.3.6. China
11.3.6.1. Market Revenue and Forecast, by Product (2016-2027)
11.3.6.2. Market Revenue and Forecast, by Type (2016-2027)
11.3.6.3. Market Revenue and Forecast, by Deposition Technology (2016-2027)
11.3.6.4. Market Revenue and Forecast, by Application (2016-2027)
11.3.7. Japan
11.3.7.1. Market Revenue and Forecast, by Product (2016-2027)
11.3.7.2. Market Revenue and Forecast, by Type (2016-2027)
11.3.7.3. Market Revenue and Forecast, by Deposition Technology (2016-2027)
11.3.7.4. Market Revenue and Forecast, by Application (2016-2027)
11.3.8. Rest of APAC
11.3.8.1. Market Revenue and Forecast, by Product (2016-2027)
11.3.8.2. Market Revenue and Forecast, by Type (2016-2027)
11.3.8.3. Market Revenue and Forecast, by Deposition Technology (2016-2027)
11.3.8.4. Market Revenue and Forecast, by Application (2016-2027)
11.4. MEA
11.4.1. Market Revenue and Forecast, by Product (2016-2027)
11.4.2. Market Revenue and Forecast, by Type (2016-2027)
11.4.3. Market Revenue and Forecast, by Deposition Technology (2016-2027)
11.4.4. Market Revenue and Forecast, by Application (2016-2027)
11.4.5. GCC
11.4.5.1. Market Revenue and Forecast, by Product (2016-2027)
11.4.5.2. Market Revenue and Forecast, by Type (2016-2027)
11.4.5.3. Market Revenue and Forecast, by Deposition Technology (2016-2027)
11.4.5.4. Market Revenue and Forecast, by Application (2016-2027)
11.4.6. North Africa
11.4.6.1. Market Revenue and Forecast, by Product (2016-2027)
11.4.6.2. Market Revenue and Forecast, by Type (2016-2027)
11.4.6.3. Market Revenue and Forecast, by Deposition Technology (2016-2027)
11.4.6.4. Market Revenue and Forecast, by Application (2016-2027)
11.4.7. South Africa
11.4.7.1. Market Revenue and Forecast, by Product (2016-2027)
11.4.7.2. Market Revenue and Forecast, by Type (2016-2027)
11.4.7.3. Market Revenue and Forecast, by Deposition Technology (2016-2027)
11.4.7.4. Market Revenue and Forecast, by Application (2016-2027)
11.4.8. Rest of MEA
11.4.8.1. Market Revenue and Forecast, by Product (2016-2027)
11.4.8.2. Market Revenue and Forecast, by Type (2016-2027)
11.4.8.3. Market Revenue and Forecast, by Deposition Technology (2016-2027)
11.4.8.4. Market Revenue and Forecast, by Application (2016-2027)
11.5. Latin America
11.5.1. Market Revenue and Forecast, by Product (2016-2027)
11.5.2. Market Revenue and Forecast, by Type (2016-2027)
11.5.3. Market Revenue and Forecast, by Deposition Technology (2016-2027)
11.5.4. Market Revenue and Forecast, by Application (2016-2027)
11.5.5. Brazil
11.5.5.1. Market Revenue and Forecast, by Product (2016-2027)
11.5.5.2. Market Revenue and Forecast, by Type (2016-2027)
11.5.5.3. Market Revenue and Forecast, by Deposition Technology (2016-2027)
11.5.5.4. Market Revenue and Forecast, by Application (2016-2027)
11.5.6. Rest of LATAM
11.5.6.1. Market Revenue and Forecast, by Product (2016-2027)
11.5.6.2. Market Revenue and Forecast, by Type (2016-2027)
11.5.6.3. Market Revenue and Forecast, by Deposition Technology (2016-2027)
11.5.6.4. Market Revenue and Forecast, by Application (2016-2027)
Chapter 12. Company Profiles
12.1. Nichia Corporation
12.1.1. Company Overview
12.1.2. Product Offerings
12.1.3. Financial Performance
12.1.4. Recent Initiatives
12.2. Cree Inc.
12.2.1. Company Overview
12.2.2. Product Offerings
12.2.3. Financial Performance
12.2.4. Recent Initiatives
12.3. Qorvo
12.3.1. Company Overview
12.3.2. Product Offerings
12.3.3. Financial Performance
12.3.4. Recent Initiatives
12.4. Samsung Electronics
12.4.1. Company Overview
12.4.2. Product Offerings
12.4.3. Financial Performance
12.4.4. Recent Initiatives
12.5. Taiwan Semiconductor Manufacturing Company Ltd.
12.5.1. Company Overview
12.5.2. Product Offerings
12.5.3. Financial Performance
12.5.4. Recent Initiatives
12.6. STMicroelectronics NV
12.6.1. Company Overview
12.6.2. Product Offerings
12.6.3. Financial Performance
12.6.4. Recent Initiatives
12.7. NXP Semiconductor N.V.
12.7.1. Company Overview
12.7.2. Product Offerings
12.7.3. Financial Performance
12.7.4. Recent Initiatives
12.8. Texas Instruments Inc.
12.8.1. Company Overview
12.8.2. Product Offerings
12.8.3. Financial Performance
12.8.4. Recent Initiatives
12.9. Renesas Electronics Corporation
12.9.1. Company Overview
12.9.2. Product Offerings
12.9.3. Financial Performance
12.9.4. Recent Initiatives
12.10. Infineon Technologies AG
12.10.1. Company Overview
12.10.2. Product Offerings
12.10.3. Financial Performance
12.10.4. Recent Initiatives
Chapter 13. Research Methodology
13.1. Primary Research
13.2. Secondary Research
13.3. Assumptions
Chapter 14. Appendix
14.1. About Us
14.2. Glossary of Terms
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